Test Requirement of PCB Reverse Engineering

Test Requirement of PCB Reverse Engineering

The first step is of Test procedure after PCB Reverse Engineering is initial inspection. The test requirements to be determined include initial inspection and testing of the hardware provided for PCB reversing engineering, and for inspection and acceptance of the prototype to be built and tested in accordance with the preliminary TDP. Special testing and test equipment/fixture requirements should be identified and a test plan developed.

Second step is test plan objective, the objective of the test plan is to verify adherence to the requirements delineated in the applicable specifications and standards, including verification of performance, determination of reliability and endurance, and verification of structural integrity.

Third step is worse-case analysis. If the available documentations lacks sufficient test data, a worse-case analysis should be performed to develop testing criteria and procedures, including critical failure modes and limitations. Experts in the field should be contacted to identify common failure areas.

The tests for item failure limits, such as overload, fatigue, vibration, and temperature, are the most convincing means of ensuring equivalence of manufacture. The Acceptance Test Procedures should define these requirements and specify the test procedures in accordance with the applicable specifications and standards.