Soldering Pad From Printed Circuit Card Cloning
Soldering Pad is a very important concept in the Printed circuit card Cloning process, however it is quite commonly be ignored by preliminary learner about their selection and edition, instead of choosing the round soldering pad in all of the cases of Printed circuit card Cloning. the selection of the soldering pad must take the other aspects of Printed circuit card Cloning into account comprehensively which include the shape, size, type of placement, vibration, and heating situation, force orientation, etc. In the library of Protel designer has present a series of soldering pad with different sizes and shapes, such as round, square, registration pads, etc. and sometimes the resources in the library is not enough and require to edit by the engineers who engage in the Printed circuit card Cloning themselves. for example, for those soldering pad which generate a lot of heating, withstand great force and great current, the shape of the solder pads must be designed as tip drop shape. generally speaking, edit the soldering pad must take below facts into consideration:
first is if the length of the shape is different then the width of the tracks and specified length of the soldering pad must be taken into account to avoid the great difference on the length;
second is choose the soldering pad with different length to connect the components with connecting point is a preferable choice;
third is the through hole of the pin of each components must be edited according to the size of the pin itself, normally the size of the hole will be 0.2 to 0.4 mm larger than the lead diameter;
Welcome to Circuit Engineering Co.,Ltd. which provide the service for Printed circuit card Cloning.
We are a Full Service Contract Manufacturer specializing in Defense, Commercial and Industrial Electronics for over 40 years. Circuit Engineering Co.,Ltd. offers the latest in Technology Solutions such as Printed circuit card Cloning, Turnkey Manufacturing and Engineering Services. Our capabilities include:
Low to Medium Volume, High Mix, High Complexity Assemblies
Product Development, Transition and New Product Introduction
RF Capability Engineering, Manufacturing and Test
Full Spectrum Test and Development Flying Probe, ICT, ESS and Functional
Design For Manufacturability and Test Services
Tin Whisker Mitigation
Tags: cloning printed circuit card artwork,cloning printed circuit card bom,cloning printed circuit card data,cloning printed circuit card design,cloning printed circuit card drawing,cloning printed circuit card gerber file,cloning printed circuit card layout,cloning printed circuit card part list,cloning printed circuit card schematic