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You are here: Home > 3D Reverse Engineering > SMT Hybrid Packaging 2014 ends successfully

SMT Hybrid Packaging 2014 ends successfully

After three intense exhibition days, the SMT Hybrid Packaging closes its doors with a positive result.
Figures for 2014
Exhibition space: 27.000 m²
Exhibitors: 498 (as well as 58 represented companies)
Trade visitors: approx. 20.000
© MesagoAround 20,000 trade visitors came during the fair in Nuremberg and benefited from the latest developments and trends in the industry. These were presented by 498 renowned national and international companies. The event was characterized as a networking platform, in which positive and intensive discussions and exchange of expertise were the focus.

At the SMT tutorials on Tuesday, 6 May 2014, both newcomers and experts were able to build and to expand their knowledge in the domain of the electronic component manufacturing in practice-oriented tutorials on a high professional level.

Read more: http://evertiq.com/news/34355

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