Reverse Engineering Radar Module Circuit Board

The second Reverse Engineering Radar Module Circuit Board method uses a dielectric integrated waveguide (SIW) circuit to clone the design of radar antenna PCB board module, and the radar antenna is no longer a microstrip patch antenna. Except for the antenna, the other multilayer PCB stack-ups still use the same FR-4 material for the radar control and power planes as in the first method.

The PCB material used in the antenna design of this SIW still uses ultra-low loss PCB material to reduce the loss and increase the antenna radiation. The thickness of the material is usually thicker than the PCB to increase the bandwidth, which can also reduce the influence of the roughness of the copper foil, and there are no other problems when processing narrower line widths. However, the via processing and position accuracy of SIW need to be considered.

The third Reverse Engineering Radar Module Circuit Board method is to design the stack structure of multilayer PCB boards gerber file cloning with ultra-low loss materials. Depending on the needs, it may be possible to use ultra-low-loss materials for several layers, or it may be possible to use ultra-low-loss materials for the entire stack. This design method greatly increases the flexibility of circuit design, can increase the integration, and further reduce the size of the radar module. But the disadvantage is that the relative cost is relatively high and the processing process is relatively complicated.