Reverse Engineering PCB Board Procedures

Reverse Engineering PCB Board Procedures include electronic parts stripping off, layer circuitry pattern scanning and delayering, PCB layout and Gerber file drawing, restore schematic diagram from PCB card layout drawing;

If the soldering pad, and through hole size is too small, or the soldering pad size can’t match with the drilling hole size, it will bring damage to the manual drilling as well as the digital control drilling.

And it will probably drill the soldering pad as C shape and avoid the dynamic effect over manufacture PCB Board, even strip off the soldering pad. If the track is too thin, and there is no filled copper on the un-layout area without any tracks on it, it will cause the in-sufficient or uneven etching, after these areas hasn’t been etched, it will cause the over-etching in the area where has been layout the thin wires, or over etching, or completely broken.

Consequently, the functions of filled copper is not only increase the ground size and increase its capability of anti-interference. These factors are all able to bring the damage to the quality and reliability of Made Printed wiring board by reverse engineering layout.

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