Reverse Engineering PCB Board Conductor

In the process of reverse engineering PCB board, the conductors on the adhesive layers of pcb board should be layout in the format of vertical, curve or tilted cross, to avoid the parasited coupling when reverse engineering pcb board; the signal wire with high frequency should avoid the parallel layout to avoid the signal feedback or cross-talk, we can add a grounding line among the parallel conductors.

Layout the signal line which connect to the external area, shorten the input lead as much as possible, improve the input terminal impedance when reverse engineering pcb board. Use shielding technology on the simulated signal input line, if there are co-existence of analog, digital signals, their grounding line should isolated as much as possible when reverse engineering pcb board to avoid the cross talk and interference.

Deal with the abundan input terminal on the logic component properly.

Choose the standard electronic components, if it is necessary to create the component package, the soldering pad distance should align with component lead pitch, to decrease the lead impedance or parasite capacitance for the purpose of pcb board reverse engineering. Reduce the metallic through hole when layout pcb board, to improve the reliability of whole pcb board.

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