Reverse Engineering Electronic PCB Board

Reverse Engineering Electronic PCB Board should consider the heat dissipation issue since the over-heat can lower down the performance of electronic products.

In view of better thermal dissipation, printed circuit board must have been installed in the integral orientation, and the distance between PCBs should not less than 2cm, furthermore, the arrangement of components on the Electronic pcb board must follow certain rules;

1, In the vertical orientation, high power consumption components should be placed close to the edge of PCB Board, to shorten the thermal transfer route; in the integral orientation, high power component should be place on the higher part, to reduce the impact of these components against others;

2, for those components which are more suspect to the temperature should be placed in the low temperature area such as the bottom of device, and please be noted these parts should not be place on top of the components which generate lots of heat;

3, inside the facility, Electronic pcb board is mainly rely on the air flow to cool down the system, so during the process of Electronic circuit board reverse engineering, the direction of air flow must be taken into consideration, rational route and install the components on the PCB card can make PCB card cloning become more simple. As common sense, air will flow from the place to where with less restriction and force, so when install the components onto PCB card, should avoid the large space saved;

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