Printed Wiring Board Reverse Engineering Element Definition

Printed Wiring Board Reverse Engineering can make your own element definitions graphically now. Simply draw vias for the pins, lines on the solder and/or component layers for surface-mount pads (they must be either horizontal or vertical), and lines and arcs on the silkscreen layer for the silkscreen outline from automatic barcode printed circuit board duplicate. You should name (N key) each via and copper line with the pin number.

Once you are happy with the geometry, select everything that is to become part of the element, then choose ‘convert selection to element’ from the Select menu. Afterwords you can make pin (or pad) one square if you like from precision pulse sound level meter pcb board duplication, and give the element its various names. You can also give the pins and pads their functional names.

Note that the element mark corresponds to the position you click after choosing the conversion from the menu, so decide where the mark goes and make sure it falls on a grid point before you request the conversion. If the vias/lines are not named, then the pin numbering will correspond to the order in which they were placed.

When you create a new element, remember that silkscreen lines should never overlap the copper part of the pins or pads, as this can interfere with soldering. The silkscreen should identify the maximum extent of the element package so it is easy to see how close elements can be placed together.

If you want to make an element similar to an existing one, you can break an element into constituent pieces from the Buffer menu. Paste the pieces to the layout, make the necessary changes, then convert it back into an element. If the pin numbers haven’t changed, there is no need to name each via/line as they are pre-named when the element was broken apart.

When you create a new element, you can save it to a file in order to have easy access to it the next time you run PCB Reverse Engineering.

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