Printed Wiring Board Reverse Engineering Defects

Printed Wiring Board Reverse Engineering Defects has a close connection to its assembly is actually a process of chemical one. Printed wiring board provide the mechanical support for all the electronic components in the product as well as the electrical connection among them, accompany with the electrical technology development, the density of Printed wiring board can be higher, and more and more layer count being involved.

Sometimes just the bad performance on the Printed wiring board assembly while all the other aspects are correct include. As a result of that, the items that affects the stability of printed wiring board assembly quality must be considered and take the causes into consideration. Below we will introduce some reasons what affect the Printed wiring board assembly quality:

In the Printed wiring board reverse engineering, if the Printed wiring board is too large to assemble, although it could be easier to assembly, but due to the long track on the Printed wiring board which can cause higher impedance and the capability to resist noise decrease while cost increase; if the size of PCB board is too small, will cause difficulty in heat dissipation and cross intersection among the two lines, such as the electromagnetic interference in the Printed wiring board assembly. As a result of that, we have to optimize the Printed wiring board reverse engineering from below aspects:

1 Shorten the connection distance among the high frequency component to decrease the EMI interference;

2 the weight over 20g components should be fixed on a socket instead of assembly on the printed wiring board directly when reverse engineering it;

3 the component with high heat dissipation issue must be considered to prevent the defects and rework and all the thermo-sensitive part must keep away from heat source;

4 all the arrangement of component must be parallel which will have better cosmetic and easier to solder for mass production, printed wiring board design should be 4:3 ratio. And the width of track shouldn’t alter suddenly to avoid the inconsistency;

5 printed wiring board can probably swelled and copper foil strip off the printed wiring board due to constant heating. we should avoid the application of large size of copper foil;

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