High Density Interconnect Printed Circuit Card Reverse Engineering

First of all it is High Density Interconnect Printed Circuit Card Reverse Engineering:

The quantity increasing of Semiconductor’s complexity and logic gate will require the integrated circuit to embed with more and more pin-outs and finer patch among these pins. Design more than 2000 pins or above on a BGA component which has 1mm pitch as the pins distance is quite normal today, not mention the layout of 296 pins on the components with only 0.65mm pitch.

Faster and faster rising time plus signal integrity requirement, and need to have more power supply and grounding pins, and need to occupy more layers in the multilayer board, as a result of that, the requirement for high density interconnect technology which can embed more micro-vias Printed circuit card will raise. High Density interconnect is still an developing technology through which can allow micro-vias, super thin dielectric, thinner wire track and smaller wire space as the main features.

From Front point to end point’s typical integrated systematic design: From circuit card replication stage will input the restricted rules which can be used for the physical realization, it will reduce the error proportion which can occur to manufacturing. Footprint pin switch, logic gate switch, even the input/output ports switch are all need to revert to design definition stage, as a result of that, the Printed circuit card Reverse Engineering and design on each stage are all synchronized.

Circuit Engineering Co.,Ltd. is a small business located in shenzhen, china in a 10,000 square foot manufacturing facility. We are dedicated to customer service and offer comprehensive PCBA Replicating services tailored to meet our customers’ needs. Our staff is friendly and courteous and stands ready to assist you by providing superior Printed circuit card Reverse Engineering Services at competitive prices.

Full service PCB Reverse Engineering service provider of medical, commercial and industrial electronics
In house design and development engineering
Low to mid volume manufacturing GMP Certified
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Follow IPC A 610 Standards

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