Printed Circuit Card Reverse Engineering

How is the ground bounce noice affect and interfere the effective signals?  How to eliminate the Return path noise?  In most of the scenarios, the unreasonable original PCB board layout drawing of return path is a key issue for malfunctioning printed circuit card, and return path is also the most head scraching issue for design engineers but through the printed circuit card reverse engineer we will be able to solve it.

How to distribute the current rationally in the printed circuit card electrical connecting system. Especially the current in the grounding layer become much more difficult, and if the main current can’t be distributed evenly in the PCB board system, it will lead directly to the unstability of Printed circuit card functionality in the process.

There are several other commonly see issues which can be solved by circuit card reverse engineering implementation process such as upward rush, downward rush and ocsillation, time delay, impedance matchment, burrs. However, in order to reverse engineering high speed printed circuit card in a proper way, should consider in both aspects of signal integrity and power integrity, although the result could be revealed from the signal integrity, but we can’t omit the effect of power integrity in the printed circuit card reverse engineering. Since the power integrity can affect the printed circuit card signal integrity finally.

Welcome to Circuit Engineering Co.,Ltd. which provide the service for PC board reverse engineering.

We are a Full Service Contract Manufacturer specializing in Defense, Commercial and Industrial Electronics for over 40 years. Circuit Engineering Co.,Ltd. offers the latest in Technology Solutions such as printed circuit card reverse engineering, Turnkey Manufacturing and Engineering Services. Our capabilities include:

Low to Medium Volume, High Mix, High Complexity Assemblies
Product Development, Transition and New Product Introduction
RF Capability Engineering, Manufacturing and Test
Full Spectrum Test and Development Flying Probe, ICT, ESS and Functional
Design For Manufacturability and Test Services
Tin Whisker Mitigation

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