Printed Circuit Board Reverse Engineering Signal Issue Solution

In the process of Printed circuit board Reverse Engineering, signal integrity issue plays an increased important role of reliability performance, engineers spend more time and energy to solve this issue on the term limitation and definition process. Through the application of signal analysis tools in the early stage, and operate multiple simulation, carefully organize the printed circuit board topology structure and manipulate the comprehensive restricted terms like electrical features and physical features to avoid the EMI problems.

Most of the typical reverse engineering environment is all focus upon the reverse engineering later stage, and the printed circuit board drawing will be the main consideration item. Currently the reverse engineering tools service provider are set out to address this new reverse engineering challenge. But engineers need to complete renew solution to address the more and more difficult high speed pcb board reverse engineering issue. Through this method, reverse engineering engineer can solve the problem in the early stage.

If reverse engineeringer want to solve the high speed signal transmission issue without reply on the expensive and time consuming printed circuit board testing procedure, the key point is execution of tremendous signal integrity analysis. Engineer can re-layout the copper track, and redefine the copper layer definition and layout topology of timing clock, selection of component with certain speed to ensure the first yield rate of circuit board reverse engineering.

There is a lot of restriction when using the previous signal integrity analysis tools either is too difficult to use or not able to analyze the whole reverse engineering system. As a result of that, Engineers can only decide which key point circuit network should be emphasized on according to their experience, or through the application of comprehensive tools to do the analysis work.

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