Printed Circuit Board Reverse Engineering Layer Count

Printed Circuit Board Reverse Engineering Layer Count is an important item to affect the whole process, which will greatly increase the complexity and uncertainty over the project itself;

The more layer count on the target Printed circuit board which need to be reverse engineered, the higher cost it will have, however, the Printed circuit board with less layer count can increase the dimension of Printed circuit board.

Drilling requires to spend time on the Printed circuit card cloning, so the less quantity of the through holes,  the lower manufacturing cost it can have, buried via is more expensive than the through via which go through the whole layer-up structure system, since the buried via must be drilled before the lamination.

The size of drill hole on the Printed circuit board must be decided by the diameter of leads on the electronic components. Since if there are different types of components on the Printed circuit board which can be specifed in the gerber file and layout scheme acquired from PCB board reverse engineering, then the drilling machine can’t use the same drill bit to finish all through holes, as a result of that, the time length of drilling process will be postponed and cause the rising up manufacturing cost.

All in all, the effort the device maker emphasized on the Printed circuit board design is more and more complicate. It is quite useful to understand the manufacturing process. Since when we are about to Reverse Engineering Printed circuit boards, we will definitely make a comparison, and at this moment we will find out that the Printed circuit board with same functionality could have different manufacturing cost, while the stability of it can be varied too, through this point we can make a preliminary judgement about capability of each mainboard design.

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