Printed Circuit Board Reverse Engineering EMC Affection

Printed Circuit Board Reverse Engineering EMC Affection will greatly affect the performance of electronic PCB board, through modify the PCB board schematic diagram, layout drawing and gerber file can effectively improve the EMC performance of PCB board; 

Printed Circuit Board Reverse Engineering EMC Affection will greatly affect the performance of electronic PCB board, through modify the PCB board schematic diagram, layout drawing and gerber file can effectively improve the EMC performance of PCB board
Printed Circuit Board Reverse Engineering EMC Affection will greatly affect the performance of electronic PCB board, through modify the PCB board schematic diagram, layout drawing and gerber file can effectively improve the EMC performance of PCB board

There are several different elements which can affect the EMC effect, first of all it is the voltage, the higher voltage the power supply has, the oscillation from it will radiate more power and the voltage with lower power supply can affect the sensitivity.

2nd is the frequency, high frequency can generate more radiation after PCB Plate copying, and periodic signal can radiate more into the system. So in the high frequency digital system, the switching of components can generate current peak signal; however, in the analog system, if the overload current alternation will bring current peak signal.

Grounding is the 3rd item to affect the EMC, refers to the circuit design, it is nothing more reliable and perfect than power supply system In the design. In all of the Electronic magnetic compatibility issue, and the main issue is the improper grounding, there are three signals grounding way: single point, multiple points and mixed points. When the frequency of the PCB is lower than 1Mhz, it is better to choose the single point grounding way, but it is not suitable for the high frequency from PCB card Reverse Engineering.

In the high frequency application, it is better to choose the multiple grounding connection, the final way is mixed grounding method which means the lower frequency single point grounding and high frequency multiple points grounding are co-exist in the system after PCB board copying.


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