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You are here: Home > Reverse Engineering PCB > Printed Circuit Board Reverse Engineering Defect

Printed Circuit Board Reverse Engineering Defect

Both Printed Circuit Board and component will have bow and twist after manufacturing, due to stress distortion cause cold soldering and short circuit. Bow and twist of printed wiring board are normally caused by the imbalance heating. For large printed wiring board, due to the gravity of printed wiring board itself will have a certain of bow and twist. If the component on the printed wiring board is very big, accompany with the recovery of printed wiring board after the temperature back to normal, the soldering point will constantly under the effect of stress and once the component raise 0.1mm, will surficiently enough to cause cold soldering.

Printed Circuit Board Reverse Engineering Defect

Printed Circuit Board Reverse Engineering Defect

Component can have bow and twist as well, the centre point of component will be raised above the printed wiring board and cause cold soldering. When there is only solder tin exist without any solder paste, things will happen. When there is solder paste exist, solder paste and solder tin can be jointed together due to distortion and cause short circuit defect.

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