Printed Circuit Board Reverse Engineering Accurate Probing

Printed Circuit Board Reverse Engineering Accurate Probing uses controlled impedance microprobes for providing a full understanding of PCB characteristics. This technique requires specialized, costly, and setup-intensive equipment for obtaining measurements from PCB Reverse Engineering handheld probes tools.

It is the only method that can be used to extract small PCB variations and is not well suited for high volume manufacturing after display adjustment over Circuit Board Reverse Engineering.

The plots in figure 11 illustrate the TDR pulse response comparison between SMA and microprobe for the same test structure. The microprobe curve shows much less ringing and improved edge response for the open end.

It can be seen that measurement points along the SMA curve deviate from the microprobe curve. These are points at which one could take measurement data and attribute it to PCB process variation when it is really due to measurement error which can provide better usage for schematic restored from printed circuit board.

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