PCB CAD File Reverse Engineering TDR Direct Rambus Impedance Calibration

PCB CAD File Reverse Engineering can extract the gerber file from physical printed circuit board, Impedance measurements significantly different than 50 Ω can result in large errors between measured and actual. This systematic error is very common when completing Direct Rambus 28 Ω measurements where measured values can easily be off by 2–3 Ω from the actual impedance in the process of PCB card cloning.

The primary sources of error include, but are not limited to; instrument bias, probes, and cable loss. A simple means to account for these affects is to use a known reference standard close to the characteristic impedance of the line under test for PCB Reverse Engineering pre-preparation process.

Reference standards are used to determine the systematic offset between measured and actual PCB impedance. Measuring the standard with the same probe and cable that will be used for measurements connected to the instrument provides the additive effective error of the system to the probe tip. When the probe used is a known-good probe, error due to probing will be small (0.2 Ω), in most instances.

To verify the probe effects, compare the TDR response between the probed reference vs direct cable connection after PCB board Reverse Engineering inspection. If it is deemed that probe effects are negligible, measurements can be completed by direct cable connection to the standard. This is especially useful when measuring air-line standards, when probing the connector can be difficult for periodic checking.

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