PCB Reverse Engineering Pre-preparation Process
PCB Reverse Engineering Pre-preparation Process is undergoing a development process, accompany with the decreasing size of PCB dimension and increasing component density, Printed circuit board complexity level is raising up. How to realize the high layout yield rate and shorten the reverse engineering time cycle become a hot subject of PCB reverse engineering.
Before we get start to reverse engineering a PCB, analysis must be done as well as the installation of reverse engineering software which can help to make the PCB reverse engineering more reasonable and reliable.
First step is decide the PCB layer count:
PCB Dimension and layer count must be decided before the reverse engineering and layout. Since the layer count and the stack-up method will contribute directly to the PCB reverse engineering, layout and impedance. PCB dimension can serve to determine the PCB stack-UP method and track width and space to achieve the reverse engineering expectation. Currently the cost difference among different number of multilayer PCB is quite small. So it is better to choose the multilayer PCB and ensure the copper spreading is even.
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Products range from simple cables and printed circuit card assemblies (through hole and automated SMT) to large scale systems that employ numerous complex units.
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Circuit Engineering Co.,Ltd. Systems electronic contract manufacturing is set apart form other firms because of its attention to detail. All efforts are reviewed by engineering. Discrepancies in manufacturing data are found and problems corrected before the product is built. This approach has produced customer commendations and loyalty. Every product is our product whether the customer or our name goes on it.
Working from schematics, or less than complete data, is regarded as challenge and not an impossible task as it is by some.