PCB Reverse Engineering Handheld Probes
PCB Reverse Engineering Handheld Probes can play an important role in the process of Printed circuit board remanufacturing to inspect the precision and correctiveness of Layout drawing and gerber file;
The easiest, most commonly used probe is the handheld probe of EMS effect in the PCB Reverse Engineering with ground spanner. This probe is useful for quick process variation checks but is not the best for accurate, repeatable measurements.
A common problem with handheld probing is measurement variations due to the ground spanner mechanism of the probe especially for multilayer one with PCB board Reverse Engineering layup issue. Selecting the proper ground spanner is critical to minimizing the discontinuity due to the probe ground loop. Minimizing the ground loop reduces the inductance spike (high impedance) as the pulse launches into the load under test. The benefits of minimizing the ground loop are improved settling time, response smoothness and probe loss.
The illustration shows the difference between two different ground spanners for the same probe. The difference between ground mechanisms were determined by using two different ground spanners provided with the Tektronix P6150 kit that are very similar to the drawings extracted from high speed Printed Circuit Board Reverse Engineering.
Figure 8 shows how ground loop differences affect settling time, response smoothness and the impedance measured. SMA connectors soldered to the board will provide good repeatability but adds test cost due to the SMA connector and reduces throughput time due to soldering. These probes are useful for correlation between vendors and customers to detect and inspect the Printed Circuit Board Reverse Engineering design.
The plots in Figure 10 illustrate the repeatability differences between SMA connectors and handheld probe techniques. The SMA curves show good repeatability between instances of disconnecting and reconnecting the coax cable if PCB Reverse Engineering. The handheld probe curves exhibit variation due to different ground points, pressure applied on the ground spanner and the angle at which the probe is held.
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