PCB Card Reverse Engineering Optimization

PCB Card Reverse Engineering Optimization can improve the performance of Convertor, as for the turn on and off switch convertor, an outstanding pcb card reverse engineering layout can regain the best systematic performance is one of the most critical points. if the layout drawing, gerber file and schematic diagram obtained from reverse engineering PCB is improper, it can directly result to below consequences:

1^st of all is too much noise in the control circuit can affect the stability of the system;

2^nd, there is too much loss on the pcb card tracks which will directly affect the efficiency of the system;

3^rd, and too much electro-magnetic interference on the system will affect compatibility of the system;

ZXLD1370 is a multiply topology turn on/off switch LED controller, each one of the different topology structure will have a external embedded switch components. this LED driver is suitable for the pressure lifting, going down or other modes.

As for the turn on/off switch mode power supply circuits, main switch and related power components will have great current after Pcb card Reverse Engineering. and the tracks which have been used to connect these components will have the resistors with thickness, wideness and lengthess parameters. the generated heat run through the tracks will not only decrease the efficiency but also cause the rising temperature of the tracks after PCB card Reverse Engineering analysis. in order to limit the temperature rising, ensure the width of the tracks for sufficient current route is very important.

Below equation will display the relations of temperature variation with cross section area;

Inner tracks: I=0.024×dT0.44×A0.725

External tracks: I=0.048×dT0.444×A0.725

among it, I represent the maximum current, and dT means the rising temperature which is higher than the environment; A means the cross section area . below represent the relative current capacitance’s minimum tracks width. and this is base upon the 1oz /ft2 (35um) copper foil:

as for the surface mounted components design after high speed pcb Reverse Engineering, the turn on/off mode power convertor can be used as the heatsink on the Printed circuit board copper foil. and the rising temperature on the conductors must be controlled into the lowest level, engineers suggest to limit the temperature less than 5 degree.

Below graphic can reveal the relative current capacitance’s minimum track width, which is base upon the 5 degree rising temperature on the copper foil thickness with only 1oz/ft2 (35μm) summary.

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