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"Everything we build starts with design engineering. CECL manufactured boards for one of our products. It went perfectly – a real success.It is really an high quality service they have provided to us!"

By Nile Smith from Sinotech Inc.

“We had several very old device with obsolete boards need to be replaced –through CECL professional service.We got what we needed, and we’ve been using the results of the work without any problem till now.”

By Richard Anderson from TWP system Inc.

"Guys from CECL manufacture PCBs we use in one of our products, a clinometer and we’ve never had a problem with anything. The boards come in, they work. And, their team is very responsive."

By Ken Camerlo from Hi-END ADV Inc.

PCB Board Low Inductance Grounding System Application

PCB Board Low-inductance grounding systems are the most important factor in minimizing EMC problems through PC Board reverse engineering. Maximizing the grounding area on the PCB circuit board can reduce the system grounding inductance, thereby reducing electromagnetic radiation and crosstalk.

PCB Board Low-inductance grounding systems are the most important factor in minimizing EMC problems through PC Board reverse engineering

Crosstalk can exist between any two wires on the circuit board which can be prevented by reverse engineering PCB board, depending on the mutual inductance and mutual capacitance, and is proportional to the distance between the wires, the edge rate, and the wiring impedance.

Crosstalk can exist between any two wires on the circuit board which can be prevented by reverse engineering PCB board

In high speed digital signal PCB board systems, the crosstalk generated by mutual inductance is usually greater than the crosstalk generated by mutual capacitance. Mutual inductance can be reduced by increasing the spacing between wiring or reducing the distance to the ground plane in the PCB board layout.