Multilayer PCB Board Production Material Selection

Multilayer PCB Board Production Material Selection is a Key production process to be controlled, with the development of high-performance and multi-functional electronic components, as well as high-frequency circuit board reverse engineering and high-speed signal transmission pcb board reverse engineering, electronic circuit board’s materials are required to have low dielectric constant and dielectric loss, as well as low CTE and low water absorption. rate and better high-performance CCL materials to meet the processing and reliability requirements of high-rise printed circuit boards.

Commonly used laminate copper plate suppliers mainly include A series, B series, C series, and D series. The main characteristics of these four inner layer substrates are compared in Table below.

For high-layer thick copper circuit boards, use prepregs with high resin content. The amount of glue flowing between the interlayer prepregs is enough to fill the inner layer pattern. If the insulating medium layer is too thick, the finished printed circuit board will be too thick.

On the contrary, if the insulating medium layer is too thin, it is easy to cause quality problems such as dielectric delamination and high-voltage test failure, so the selection of insulating dielectric materials is extremely important.

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