Interlayer Multilayer PCB Board Alignment Control

One of the most important elements when manufacturing multilayer PCB board is its interlayer issue, a proper and stable Interlayer Multilayer PCB Board Alignment Control can provide a reliable multilayer pcb board quality;

The accuracy of the size compensation of the inner core board and the control of the production size require the experience of the data and historical data collected in production for a certain period of time.

Accurately compensate the graphic size of each layer of the high-rise board to ensure the consistency of expansion and contraction of each layer of the core board.

Choose high-precision, high-reliability interlayer positioning methods before lamination, such as four-groove positioning (Pin LAM), thermal fusion and rivet combination.

Setting appropriate pressing process procedures and daily maintenance of the press is the key to ensuring the quality of pressing. Control lamination and cooling effects to reduce layer misalignment.

The interlayer alignment control needs to comprehensively consider factors such as the compensation value of the inner layer, the pressing positioning method, the pressing process parameters, and the material properties.