IC Chip Circuit Analysis Items

Circuit Engineering Co., Ltd can provide IC chip circuit analysis report to help customer further understand the IC chip composition and manufacture technology, include below items:

• Quantity of Metal Layer, thickness of each layer and material;
• Through hole in each layer or thickness of oxidation layer;
• Composition of through-hole;
• Scanning electron microscopy photographic structure of transistor;
• Underlay’s separation structure;
• POLICIDE or SILICIDE structure;
• Gate oxide thickness;
• Trap adulterate density’s absolute value and relative value;
• Channel adulterate density;
• Customized analysis service;

Through the understanding of advanced technology can better help customer to facilitate the IC chip design and production. Our IC chip circuit analysis include IC chip micro-section, cut scanning electron microscopy and size measurement, FIB (focused ion beam) fixed point cut, material and element analysis which are all include in the ic chip reverse engineering, etc.

Through microcontroller reverse engineering processing, we can collect the relative information about IC chip manufacture and technology. This circuit analysis report include: type of package, package material and package character, bonding wire material and character, IC chip precise measurement, IC chip floor plan, IC chip metal layer quantity, micro-photographic on specific area of different layers, etc.

 

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