Electronic PCB Card Cloning Question

Refers to Electronic PCB Card cloning question, the same ones could probably has the different answers, if the engineers you have ever hold conversation are all those ones who only have experience with the low speed Electronic pcb board clone, they will only shrug their shoulder to sign the helpless. Since in the low speed Electronic circuit card cloning, as for the potential signal integrity issue, will normally being tackled by the traditional strategy, that is customize the restricted terms.

When some of the special signals route have shown the existence of signal cross talk or electro-magnetic interference, generally speaking the design engineer will introduce part of or probably the whole pcba cloning process with more restricted physical terms.

Refers to High Speed PCB reverse engineering, even if this solution can satisfy the requirement, the designer can still pay a heavy price for fulfill it. Restricted terms on the Electronic pcb card Cloning will normally increase the final product cost and constrain its performance.

For instance, design engineer could probably very difficult to locate a proper place for a specified signal interconnection but compel to add up a signal layer after Electronic pcb card Cloning. And this kind of solution could determine if this product will be success or failure in a much competitive market orientated by the minimum cost and product integrity;

Recent days, there a famous network device manufacturer use the XTK tools set which is dedicated to the PCB board signal integrity invented by INNOVEDA to instruct the Electronic pcb card signal integrity issue for one of their router product.

The result has amazed each one of the present, although the Electronic pcb card Cloning can work properly, due to the extremely restricted terms on the design rules require to use 24 layers to avoid all the signal issues and complete integrity. And this analysis result has the phenomena of over-restriction. As a matter of this, this Electronic pcb card requires only 8 layers can satisfy its expectation, meanwhile, it won’t have the signal integrity issue. The manufacturing cost can save two millions dollars;