Cloning Printed Wiring Board Featured Impedance

Featurized Impedance in cloning Printed wiring board

When cloning Printed wiring board, the variation of technology process can cause the practical impedance difference and there are some field solver tools with on-site preciseness to foretell this phenomenon. Even without the variation of technical process, the practical impedance will have great change caused by other factors when cloning Printed wiring board. when cloning high speed Printed wiring board, the automatic design tools won’t be able to spot these issues which are not so obvious but very important. As a result of that, these issues can avoid in the process of Printed wiring board cloning if there are several precautions measures have been taken in the early stage of Printed wiring board cloning which can be viewed as the defensive design.

Lay-up issue for Printed wiring board cloning

An outstanding lay-up structure could be viewed as the best defensive measures in the course of most of the signal integrity and electro-magnetic control, at the same time, it is the easiest part to be misunderstood. And there are several factors are playing their effect, anyway, one solution which can be used to deal with an issue could deteriorate the situations of other issues when cloning Printed wiring board. most of the system design vendors will suggest that Printed wiring board cloning process should have at least a substantial platform to control the quality of signals and featurized impedance as long as the cost is affordable. This is a good advice. EMC consultant even suggest to have ground fill on the ground layer of external environment or ground layer to control the electro-magnetic radiation and sensitivity of electro-magnetic interference.

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