Cloning Electronic Circuit Board

Cloning Electronic circuit board will always refers to the component arrangement, since get the bill of material from the process of cloning Electronic circuit board is very critical, in the bill of material, each one of the resistor, capacitor, inductor, crystal value, size and footprint must be measured and record, diode, triode and integrated circuit marking should be recorded properly too. Cloning Electronic circuit board means not only get its layout, and circuit pattern drawing, schematic diagram, but also its part list, which has the clear description about each components, so when in the process of component procurement for Electronic circuit board manufacture after Electronic circuit board cloning, engineers can understand it well.

4, when components on the ELECTRONIC CIRCUIT BOARD 2mm higher than the surface of ELECTRONIC CIRCUIT BOARD such as light emitting diode, high power resistor etc, cushion should be placed beneath them when cloning ELECTRONIC CIRCUIT BOARD, since if there is no cushion pad, these components could probably be crushed and cause vibration and shock in the process of cloning ELECTRONIC CIRCUIT BOARD and conveying;

5, try to avoid place component on both side of ELECTRONIC CIRCUIT BOARD when cloning it, since it can greatly increase the assemble time and man force, so if the components should be placed on the bottom side, they should be kept as close as possible when cloning ELECTRONIC CIRCUIT BOARD which can help to complete the anti-soldering tape for protection and stripping off operation when assemble ELECTRONIC CIRCUIT BOARD;

6, make sure the components on the ELECTRONIC CIRCUIT BOARD can be arranged on the surface as evenly as possible, to low down the bow and twist, and contribute to the even distribution of heat when cloning ELECTRONIC CIRCUIT BOARD;

 

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