Circuit Board Reverse Engineering Display Adjustment

Circuit Board Reverse Engineering Display Adjustment should be completed to maximize measurement accuracy. The horizontal and vertical adjustments should be set under probing conditions. It is recommended to adjust both the horizontal and vertical scales until the launch edge is aligned with the first screen division and the reflected edge is aligned with the last.

The vertical scaling should be adjusted to maximize ~50% of the screen between the launch ledge and line under test when pcb card reverse engineering. The instrument screen should look similar to Figure 14 under probing conditions when measuring impedances lower than 50 Ω.

Cursor Positioning Method

In the ideal case, the waveform response area of interest should contain a large flat region from which to extract impedance data from circuit board reverse engineering. As previously mentioned, ringing and reflections will occur on the response, depending on probe type, inducing spikes in the waveform.

Cursor positioning on a line that is not flat will result in measurement uncertainty due to measurement variance. Selecting a position along the line after the ringing minimizes this uncertainty.

This will typically be towards the end of the trace where the line is open-circuited. This is the most common, but least accurate measurement method. This method provides useful, quick impedance checks, but is very user-dependent and is not repeatable rendering it unusable for correlation studies. Cursor positioning is usually a good way for lab measurements to determine ballpark impedance values for experienced TDR operators before PCB reverse engineering.

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