Disassembly Procedure in PCB Board Reverse Engineering

First of all is Record keeping.
When disassembling the PCB Board which is going to be reverse engineerd, notes should be recorded for possible assembly procedures to be included in the TDP. As they are disassembled, a list of all piece parts/components should be created, including quantities and special part markings which may indicate that the part is either commercially available or a military specifications part.

A layout of the parts, marked with the assembly sequence, may be useful for creating the assembly drawing and for reassembly of the item.

Secondly is Parts control.
During disassembly, each piece-part/component (bagged and tagged) should be identified to facilitate control of parts. Each piece-part/component should be examined to determine any markings which could identify the actual manufacturer, i.e., trademark, FSCM (federal supply
code for manufacturers) number, manufacturer’s name or logo, part number, patent mark, mold mark, etc.
Where lubricant is applied, look for markings on the grease fittings which may indicate the lube oil requirements. Samples of the grease or lubricant should be taken for future identification prior cleaning the disassembled parts.

Third is Terminal/pin markings.
When disassembling electrical assemblies, all terminal markings should be reviewed. If the terminal and pin location or FROM-TO data is not stamped on the wires, each end should be
clearly marked and a wire-run list should be created. The photographs with all plug and terminal designations should also be clearly marked.

Forth is Inseparable assemblies.
Items that are not bonded, welded, or otherwise permanently joined should be treated as an inseparable assembly. Destructive disassembly may not be required. If possible, all non-destructive testing of hardware should be performed prior to destructive testing.