PCB Reverse Engineering Initial Measurement

PCB Reverse Engineering initial measurement is an critical process prior to disassembly, all dimensions and electronic data should be recorded, such as orientation of each components on the schematic diagram extracted from PCB board, like inductor and transistor, location and arrangment of each wires as soon as how each wire match each connection points, input/output parameters include voltage, current and power, clearances, torque values, and assembly critical dimensions that would be unobtainable after disassembly.

On PCBs in particular, “pads” or other information may be destroyed during disassembly, because the solder iron could probably remove the vulnerable copper pads especially when PC board’s year is very old and copper pad has been exposed under the air and water for quite a while. The measurements should be taken on all moving parts and their working envelope, including rotation angles, clearances between close tolerances, and non-critical dimensions.

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