SMT PCB Reverse engineering Principle

1 The electronic components placement of SMT PCB Reverse engineering

1> when SMT PCB being placed on the convey strap of reflow oven, the longer axis of component should be reverse engineeringed to vertical to the orientation of conveying. Which can prevent the floating or standing of components on the SMT PCB;

2> components on the SMT PCB should be reverse engineeringed evenly especially to separate the great power electronic components to avoid the heating trapping on certain point and cause overheating which will affect the soldering point stability directly;

3> When reverse engineering SMT PCB with component assembly on both sides, the component with big size should be reverse engineeringed on the different place on both sides otherwise the soldering result will be affected due to the concentration of heating;

4> on the wave soldering side, component with PLCC or QFP footprint should not be reverse engineering SMT PCB;

5> SMT components on the PCB wave soldering side should be reverse engineeringed paralleled with direction of wave soldering flow which can greatly decrease the solder bridge between electrical polarity;

6> all the SMT components on the wave soldering flow side shouldn’t be reverse engineering SMT PCB on the same line, but need to on the separate places to prevent the shadow effect when waving flow to cause the cold soldering or leak soldering.

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