High Speed PCB Board Reverse Engineering
High Speed PCB Board Reverse Engineering
When reverse engineering PCB board, there are several issues will be existed in the process, from one side, PCB board reverse engineering need to make sure all of the components place close to each other, it can help to shorten the circuit when reverse engineering PCB board, low down the cross-talk, reflection even electro-magnetic radiation and keep the signal integrity; from other side, the spectrum generated by Radio frequency from different logic part is various too, especially in the high speed PCB board reverse engineering system, the higher the signal frequency, the radio frequency energy bandwidth generated from the digital signal jump operation is wider for PCB board reverse engineering, so in order to prevent the mutual interference among different components which has various bandwidth, High Speed PCB board reverse engineering rules must be draw and carefully preserved, in order to solve these issues, engineers have to divide PCB Board according to different functional block, which means separate the PCB board physically by different functional sub-system. Different PCB board Reverse Engineering will apply different separation methods, can normally apply the multiple PCB board, part isolation and Layout, etc. appropriate separation on the PCB board reverse engineering can help to optimize the signal quality, simply the layout, and low down the interference. Engineer should be aware of which part belongs to what block when reverse engineering PCB board and these information can be obtained from part vendors.
Functional separation can be viewed as the separation of one functional block from another, in order to separate the circuit with different functions when reverse engineering PCB. When reverse engineering PCB, there is one simple purpose is restrict the related electro-magnetic field from specific sub-united into the area where need them. For example, engineer hopes the electro-magnetic energy from processor area won’t convert to I/O circuit. there is electrical potential difference exist among processor and I/O circuit, as long as it exist, then there will be common model energy conversion among them, so their separation must be decoupling with high quality level.
Functionality separation will need to pay attention to two aspects: handle conversion and radiation from the Radio frequency energy. Radio frequency transmitted energy can be distributed among functionality sub-system and power supply distribution system through the signal line, PCB reverse engineering is mean to distribute the useful signals to where required it and reject those without any usage.
Make practice of reverse engineering PCB separation includes two meanings: separation and interconnection.
Separation can use moat in each layer to form the blank area without copper foil clad, Moat minimum thickness is 50mil and it is like a fosse to separate the PCB into different islands.
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