Cloning Printed Circuit Board Dissipation

Cloning Printed Circuit Board should consider the heat dissipation issue since the over-heat can low down the performance of electronic products. In view of better thermal dissipation, Electronic PCB board must have been installed in the integral orientation, and the distance between PCBs should not less than 2cm, furthermore, the arrangement of components on the PCB board must follow certain rules;

1, as for those facilities which apply the free air ventilation to cool the PCB board, and it is better have all of the integrated circuits or other components layout in the long orientation;

But if the heat dissipation is engaged by the strong cold air ventilation, the integrated circuits or other components layout in the short orientation;

2, the components on the same printed circuit board should be layout according to its heat dissipation amount and level, those parts with low heat generation or poor thermal resistance such as the diode with small signals, small scale integrated circuit, and electro etc should be placed on the highest level of cooling air (in the entrance), those parts which generate higher heat or with better heat resistance such as crystal oscillator, and integrated circuit with large size should be place on the downstream of ventilated air;

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